In a narrow sense, PCB copy board refers only to the process of extracting and restoring PCB files of electronic product boards and board cloning using files; In a broad sense, copy board not only includes board file extraction, board cloning, and circuit
PCBA testing is an extremely important part of the entire Electronic Manufacturing Services. It can strictly control the quality of shipments in the final stage, and find problems timely to adjust the previous processes such as SMT and DIP, optimize the p
Normally, the customer will place sample PCBA order before mass production. What is the purpose of this? First, it is to check whether there is problem in PCBA design; Secondly, it is to screen out the reliable supplier and ensure the yield and test pass
PCBA test is an important part of controlling the quality of products in the PCBA process. It is to check whether the PCBA has sufficient reliability to complete the future work. This will directly affect the user’s experience and repair rate in the futur
In order to ensure the stability and reliability of PCBA products, after the PCBA processing is completed, it is best to conduct a casual inspection of Burn-In Test. The main purpose of Burn-In Test is to simulate by combining the high temperature, low te
Generally, most of PCBA products will use plenty of connectors. Unfortunately, it occurs a problem that the connector will deform after the reflow, which lead to a defect that the FFC (Flexible Flat Cable) will become bad contact once it’s inserted.
Since the biggest difference between PCBA "rinsing process" and "no rinsing process" is flux, and the main purpose of rinsing is "removing flux residue" and other pollution, then we should know the types of flux.
The PCB need to be washed after soldering at very first. That's to say, when the PCB has finished "Wave soldering" or "Surface Mount", The pollutants on the board will be cleaned with detergent or pure water. Gradually, as the design o
1.1 Common problems
A.Orifice bubble
B.The plug hole is not full
C.Resin and copper layering
1.2 Consequences
A. There is no way to make a pad on the hole; the hole is hidden, the chip is mounted and blown, also called out-gassing