1. Preliminary preparation stage
2. Design and development
3. Design and editing of work instructions for SMT production process
4. Confirmation of stencil production capacity
5. Confirmation of the programming and operating capabilities of the placem
Vias-in-pad or vias-on-pad is a very headache for printed circuit board assembly factories, especially when the vias are placed on the BGA (Ball Grind Array) pad. However, design units often force assembly factories to follow suit due to insufficient desi
1. Placement area of fire extinguisher
2. The placement area of the material storage cart
3. Placement area of the preparation table
4. Small table placement area for printing station
5. Solder paste placement area
The selection of components should fully consider the needs of the actual area, and use conventional components as much as possible. Do not blindly pursue small-size components to avoid increasing costs. IC selection should pay attention to the pin shape
In PCB Assembly, wave soldering is to make the soldering surface of the plug-in board directly contact with high-temperature liquid tin to achieve the purpose of soldering. The high-temperature liquid tin maintains a slope, and a special device makes the
Plenty of people probably do not know the difference between high-end PCB and common PCB? Because there is not much difference in appearance;
However, if a hardware engineer is new to layout multilayer PCBs who will be easy to get dizzy. There are
Past-In-Hole (PIH) is to print solder paste directly on plated through holes (PTH, Plated Through Hole) of the PCB (Print Circuit Board), and then put the traditional plug-in/through-hole component directly inserted into the plated through-holes that have
If the printed circuit board (PCB) works in a harsh environment for a long time, then it may not work normally due to various problems. And if the circuit board cannot work normally and efficiently, we need to debug the circuit board at this time so that