1. Preliminary preparation stage
2. Design and development
3. Design and editing of work instructions for SMT production process
4. Confirmation of stencil production capacity
5. Confirmation of the programming and operating capabilities of the placem
Vias-in-pad or vias-on-pad is a very headache for printed circuit board assembly factories, especially when the vias are placed on the BGA (Ball Grind Array) pad. However, design units often force assembly factories to follow suit due to insufficient desi
1. Placement area of fire extinguisher
2. The placement area of the material storage cart
3. Placement area of the preparation table
4. Small table placement area for printing station
5. Solder paste placement area
The selection of components should fully consider the needs of the actual area, and use conventional components as much as possible. Do not blindly pursue small-size components to avoid increasing costs. IC selection should pay attention to the pin shape
Supplier: Grande Electronics
Layers: 4
Application: Access Control System PCB Assembly | PCBA Manufacturer | Grande
PCB:FR-4/1.6mm,1oz finished copper
Surface Treatment: ENIG
PCBA Lead time: 3-4 weeks
Packing: Anti-static bag and compartmenta