1. The wetting of PCBA pad and component welding surface does not meet the processing requirements;
2. The use of solder paste does not meet the processing standards;
3. The thermal expansion coefficients of welding and various electric materials are no
The solder paste is added to the component pad, after the solder paste printing of the bare PCB is completed, the relevant electronic components are mounted through reflow soldering, and then reflow soldering is performed.
The poor solderability of the circuit board holes will result in PCB Assembly and welding defects, which will affect the parameters of the components in the circuit, leading to unstable conduction between the components of the multilayer board and the inn
During PCB Assembly, processing personnel will strictly follow the bill of materials, PCB silk screen and outsourcing processing requirements to insert or mount components, but electronic components often generate more or less static electricity without p
SMT Assembly solder beads defects not only affect the appearance but also cause bridging defects. Simply speaking, solder beads can be divided into two categories: One type appears on one side of the SMD component, often in the shape of an independent lar
There are various stages in PCBA manufacturing process, including printing solder paste on the circuit board, component placement, soldering, inspection and testing. All these processes are necessary and need to be monitored to ensure that the highest qua
It is well known that SMD component is one of the materials that have more contact in SMT Repair. That’s to say, in SMT Assembly, SMD components often need to be replaced from time to time. It seems very simple to replace SMD components, but there are sti
must be soldered to the circuit board through the SMT Assembly reflow soldering process. The advantage of this process is that the temperature is easier to control, oxidation can be avoided during welding, and the cost of manufacturing products is easier
In SMT Assembly, gold has become one of the most commonly used surface coating metals due to its excellent stability and reliability. But as an impurity in the solder, gold is very harmful to the ductility of the solder, because the brittle Sn-Au (tin-gol