In the PCB layout design stage, the designer should consider adding the same size exposed copper pan in the center of QFN land pattern. This offers a heat conduit for thermal relief that makes the components work with more stability.
Wetting issues are classified by Non-wetting and Dewetting.
According to the IPC standard, non-wetting is defined as the inability of molten solder to form a metallic bond with the base metal.
Diodes are polarized components that must be placed on a PCB in a certain way. However, a board that has a (+) silk screen marking is not enough information to tell the assembly house how to correctly insert a diode because there are different types of di
According to the recommendation by the IPC association, the generic Pb-free solder reflow profile is shown below. The GREEN area is the acceptable range for the whole reflow process. Does it mean that every spot in this GREEN area should fit your board re
Proper reflow overn maintenance can extend its life cycle, keep the machine in good condition, and improve production efficiency and product quality. One of the most important tasks for properly maintaining a reflow oven is remove the built-up flux residu
Although there is a thermal data testing function for our reflow oven, Shenzhen Grande Electronic still uses a high-end, off-line, KIC thermal profiler as our key instrument for optimizing the reflow profile for every board.
Turnkey printed circuit board assembling manufacturers mainly provide both types of assembling services i.e. Full Turnkey service including ordering all parts and Partial Turnkey service where the customer arranges for circuit boards or components and the
The purpose of this document is to assist Shenzhen Grande’s clients in the process generating Gerber files using the software suite known as Eagle. Shenzhen Grande asks that its clients supply their PCB design files in this format because Gerber is the in
How to Create a Reflow Profile for a 16-layer, 2mm Thickness PCB with a High Density SMT Connector?A high density SMT connector, such as the Samtec .050" SEARAY™ High Speed High Density Open Pin Field Array, has up to 500 I/O contact pins with a sold
To place surface mounted parts on PCBs via automated equipment, it is necessary to create a Centroid file to program the equipment. A Centroid file contains all the positional parameters such that the machine knows where to place a component and in what o