Some friends who care about Shenzhen Grande should often hear Shenzhen Grande talks about the "copper" base and the "nickel" base circuit board and its advantages and disadvantages, but Shenzhen Grande believes that there are still man
In the face of constant pressure from customers and competitors, PCB designers must make products in a timely manner. In an environment where pace is so fast, product planning and implementation are extremely important, and implementation problems must be
In the past, it was not difficult to find a surface mount or through-hole wafer. However, about a decade ago, manufacturers gradually stopped making wafers for through-hole technology. Many times, the latest products are available in small QFN (quadruple
If you work in the banking and finance industry, you must have heard of fiduciary responsibility. However, there are not many people who have switched from financial industry to electronic engineering. Therefore, in the field of PCBA technology manufactur
Generally speaking, a good PCBA solder is formed, and the most vulnerable part of the solder bonding force is the IMC (Inter-Metallic Compound) layer. The IMC layer is a metal compound, and the IMC is more indispensable for good soldering. Shenzhen Grande
The production process is actually putting a bunch of components on the board. It sounds very simple, but there are still many intermediate variables. Through some confirmation processes, the error rate can be reduced a lot!
After the reliability test of Turn-key Assembly , the component high resistance value is abnormal.
The computer simulates the element on the plate stress, which match normal but cannot pass practical measure of the PCBA. Is the element and the plate ma
Nowadays, PCB process has used CCL (copper clad laminate, copper foil substrates as standard materials. And each CCL factory will specify the peeling strength of its CCL copper foil in the product specifications it provides to its customers. From these sp