Shenzhen Grande Electronic is fully capable of providing prototype and small quantity, through-hole PCB assembly services at the highest quality level possible in a cost effective manner.
Shenzhen Grande Electronic offers printed circuit board (PCB) first article assembly at the most reasonable prices than any other electronic contract manufacturers.
Shenzhen Grande uses the JTR-1000 ten zone force air convection reflow soldering system because it delivers more accurate thermal control and has power efficient technology.
The Pin-in-Paste (PIP) reflow process, also called through-hole (TH) reflow or pin-in-hole (PIH) reflow technology, has become more popular because it eliminates time-consuming processes
The process of hot air reflow soldering is essentially a heat transfer process. Before starting to “cook” the target board, the reflow oven zone temperature needs to be set up.
The most cost-effective PCB panels have a larger processing area. That’s why the most desirable PCB panels are 12in by 18in, 16in by 18 in and 18in by 24 in.