Shenzhen Grande Electronic offers inexpensive SMT assembly in China with the support of its talented workforce. You can contact us with your precise requirement and we will be glad to serve you as per your unique specifications. We have employed qualified
henzhen Grande Electronic has exclusive capabilities and talented workforce which enables to offer inexpensive 4 layer PCB prototyping services. Consumers from different regions contact us with varied specifications and to fulfill the desire of cost-effec
Surface mount devices (SMD) are soldered to PCB pads located on the surface of the board, rather than on the bottom of the board via through-hole connections. To solder SMDs to the surface of the board requires solder, flux applicator/pen, soldering tool
Shenzhen Grande Electronic has capable engineers to meet the committed tasks of the customers. We only need your requisite bill of materials (BOM) and Gerber files to review. Some customers will contact us due to our stringent adherence to prescribed guid
PCB Layout Diodes are polarized components that must be placed on a PCB in a certain way. However, a board that has a (+) silk screen marking is not enough information to tell the assembly house how to correctly insert a diode because there are different
According to the recommendation by the IPC association, the generic Pb-free solder reflow profile is shown below. The GREEN area is the acceptable range for the whole reflow process. Does it mean that every spot in this GREEN area should fit your board re
Proper reflow overn maintenance can extend its life cycle, keep the machine in good condition, and improve PCB Assembly production efficiency and product quality. One of the most important tasks for properly maintaining a reflow oven is remove the built-u
Shenzhen Grande Electronic functions with the support of experienced resources and latest technology. So it is not difficult to request a PCB assembly quote from Shenzhen Grande in China. Many buyers contact us and request for circuit board assembly quote
The tombstone phenomenon is a defect that occurs when passive SMT components are partially or completely lifted from the PCB pad. What usually occurs is that one end of chip is soldered on the PCB pad while opposite end of the chip stand ups vertically, l