Shenzhen Grande Electronics serves customers worldwide with an intelligent staff and the latest technology. Many of our customers contact us to find out what are the PCB thickness options offered by Shenzhen Grande.
HDI stands for High Density Interconnector. A circuit board which has a higher wiring density per unit area as opposed to conventional board is called as HDI PCB. HDI PCBs have finer spaces and lines, minor vias and capture pads and higher connection pad
Shenzhen Grande Electronic requires centroid data to place the surface mount parts on circuit boards. Centroid data is the machine file in ASCII text format which comprise reference designator, X , Y , rotation, top or bottom side of the board.
When the outer layers have GND and PWR stack ups, these boards should be used for short trace runs or fan outs only. The second layer is the signal layer for the purpose of HDI
This chapter relates the best practices for choosing materials to manufacture multilayer PCBs that achieve two critical requirements: (1) limit manufacturing problems (e.g., bowing or twisting, as well as mis-registering; and (2) coming up to the standard
Rows of holes are drilled alongside the boundaries of a PCB to produce plated half hole PCBs. When the holes have been through plated, the edges are pruned so the holes along the boundary are reduced in half. The edge of the PCB will look like the top of
Grande Electronics provides a PCB multi-layer stack-up services. PCB multi-layer stack-up defines the material thickness and copper weights needed to build a particular multi-layered PCB.
PCB designers must be diligent about their outline layers and their keep-out clearance. Much thought must be put into this because many problems can arise from neglecting these details.
Electronic Design Automation (EDA) typically contains all PCB footprints for commonly used components and packages but sometimes the footprints are modified a little or in most cases their dimensions are a bit off.