Supplier:Grande Electronics
Project: Rigid Flex PCB

Application:  Rigid Flex PCB for Automation Industry-PCB Manufacturer-Grande

PCB Structure: FR-4+PI+Acrylic acid+RA copper foil
Laminating Mode: mixed compression
Surface Treatment: Im Au
PCB Parameters: FR4+FPC, 1oz Finished copper, Black solder mask

Via Process: Coverlay closing
Lead Time: 10 Days

Description:

PCB Capabilities
Layers: 1-30
Quantity: 25,000 sq.m/month
PCB Types: 5oz heave copper, Impedance board, HDI, HF board, Aluminum, FPC, Rigid Flex PCB

PCB Basic Material Brand
HF: Rogers, Taconic 
HTG: S1000-2M, Lianmao IT180A
Solder Mask: Taiyo PSR-2000/4000 Series
Surface Treatment: HASL, Im Au, OSP, Im Sn, Im Ag, 50” Hard gold plated
Mixed Surface Treatment: Im Au+OSP, Im Au+Golden Finger, Im Ag+Golden Finger

PCB Technical Parameters
Min trace width/space: outer 2.5/2.5mil, inner 3/3mil(1/3, 1/2oz)
Min Via: 0.15mm/0.1mm(Laser)
Min Annular Ring: 4mil
Max copper thickness: 7oz 
Max size: 650x1100mm
Thickness Aperture Ratio: 20: 1
Tolerance
PTH: +/-0.0075mm (min: +/-0.05mm)
Outline: +/-0.1mm (min: +/-0.05-0.075mm)