Grande Electronics is a PCB Assembly manufacturer with more than 20 years of SMT experience. One-stop PCBA service is available in Grande, including PCB Layuot, PCB manufacturing, components procurement, SMT & DIP Assembly, Functional Test, and even finished product box build. And now, we will introduce the three elements about ensuring the quality of SMT.
1. Correct Components
SMT soldering states that the type, model, nominal value and polarity of each SMD component part number must meet the requirements of the product assembly drawing and BOM, and which these cannot be pasted in the wrong position.
2. Accurate Location
During SMT soldering, the ends or pins of the components and the land pattern should be aligned and centered as much as possible; Meanwhile, the solder ends of the components should be in contact with the solder paste pattern.
The self-positioning effect of the Chip components on the two ends is relatively large. During SMT soldering, more than 3/4 width of the component should be overlapped on the pad, and the two ends in the length direction only need to be overlapped on the corresponding pad and contact. The solder paste pattern can be self-positioned during reflow soldering. However, if one of the ends is not connected to the pad or does not touch the solder paste pattern, displacement or suspension will occur when reflow soldering;
Besides, BGA solder balls are aligned with the corresponding pads one by one;
The maximum offset between the center of the solder ball and the center of the pad is less than 1/2 the diameter of the solder ball.
3. Appropriate Pressure (Patch Height)
If the SMT soldering pressure is too small, the solder ends or pins of the components float on the surface of the solder paste, then the solder paste cannot stick to the components. As a result, it is prone to position shift during transfer and reflow soldering. In addition, if the Z axis height is too high, while in SMT soldering, as long as the component is dropped from a high place, which will cause the placement of the patch to shift.
If SMT soldering pressure is too high and the amount of solder paste squeezed out is too much, which is easy to cause solder paste adhesion, and bridging is prone to occur during reflow soldering. At the same time, the position of the patch will be shifted due to sliding, and components will be damaged in severe cases.
Four Reasons Why Choosing Grande To Do SMT
1. Strength Guarantee
▪ SMT factory: With imported SMT machines and multiple optical inspection equipment, which is able to produce 4 million points per day. Each process is equipped with QC personnel who will keep an eye on product quality.
▪ DIP production line: Two wave soldering machines and more than 10 employees who have worked for over three years. That’ s to say, these workers are highly skilled and can weld various SMT & DIP components.
2. Quality Assurance With High Cost Performance
▪ High-end equipment can paste precision special-shaped parts, BGA, QFN, 0201 package. It can also be soldered prototype pcba via SMT machine and placing bulk materials by hand.
▪ Both samples, small and large batches can be produced. And there is no SMT Machine starting cost.
3. Rich Electronic Products SMT Soldering Experience With Stable Delivery
▪ Accumulated services to thousands of electronics companies, involving SMT soldering services for various types of automotive equipment and industrial control motherboards. Furthermore, PCBA products are often exported to Europe and the United States, and the quality is able to be affirmed by new and regular customers.
4. Strong Maintenance Ability & Reliable After-Sales Service
▪ The maintenance engineers have sophisticated experience so that those defective boards caused by all kinds of smt soldering can be repaired. Meanwhile, ensuring the connectivity rate of each circuit board also make sense.
▪Order problems feedback will get response, solution and solved as soon as possible.
