Supplier: Shenzhen Grande Electronics
Layers: 6

Application: Solar Power Cogeneration Equipment | PCB Application | Grande Electronics

PCB Parameter: FR-4/HTG150
Thickness: 1.6 mm
Surface Treatment: ENIG

Testing: 100% E-test
Package: Vacuum packing
Lead Time: 10-15 days

Description:

PCB Capabilities
Layers: 1-30
Quantity: 25,000 sq.m/month
PCB Types: 5oz heave copper, Impedance board, HDI, HF board, Aluminum, FPC, Rigid Flex PCB
 
PCB Basic Material Brand
HF: Rogers, Taconic 
HTG: S1000-2M, Lianmao IT180A
Solder Mask: Taiyo PSR-2000/4000 Series
Surface Treatment: HASL, Im Au, OSP, Im Sn, Im Ag, 50” Hard gold plated
Mixed Surface Treatment: Im Au+OSP, Im Au+Golden Finger, Im Ag+Golden Finger
 
PCB Technical Parameters
Min trace width/space: outer 2.5/2.5mil, inner 3/3mil(1/3, 1/2oz)
Min Via: 0.15mm/0.1mm(Laser)
Min Annular Ring: 4mil
Max copper thickness: 7oz 
Max size: 650x1100mm
Thickness Aperture Ratio: 20: 1
Tolerance
PTH: +/-0.0075mm (min: +/-0.05mm)
Outline: +/-0.1mm (min: +/-0.05-0.075mm)