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6 Layers Corn Module PCB layout

Time:2018-05-16 16:56:55 Click:

Shenzhen Grande Electronic offers 6 Layers Corn Module PCB layout / ARM Processor / 18-year experienced layout team

Supplier: Shenzhen Grande Electronic
Layers: 6
Application: Corn Module PCB layout

Software: PADS
Features: Matched length for data, address and clock’s traces, used different groups and layers
Design time: 5days

PCB layout Features:
1, Matched length for data, address and clock traces.
2, Used different groups and layers

PCB Fabrication:
Layers: 6
Surface Treatment: Im Au
Material: FR-4/HTg170, 1.6mm, 1oz finished Copper
Impedance Control Tolerance: +/-10%
Others: 5/5mil,Via:8mil

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