The difference between relay and circuit breaker:
Relay: Acted as accessory circuit but can’t allow large current;
Circuit breaker: Used in main circuit system which can control not only single device but also multi device; Apart from that, wi
The principle of ENEPIG: Compared to ENIG, there is one more layer palladium(Pd) between Nickel (Ni) and Gold (Au). As you probably know, deposition thickness of Ni is 120~240μin (about 3~6μm), Pd is 4~20μin( about 0.1~0.5μm) and Au is 1~4μin (about 0.02~
Found in the majority of checking the defect in soldering, manual and automatic system inspection methods remain immensely popular, such as the combination of manual optical inspecion and X-ray detection is the optimal method in terms of cheking soldering
All BGA components come into their own when it comes to reworking where heating cycle of components and potential ESD times of reforming tin balls is a major consideration.
Mixed signal integrated circuit refers to the circuit that includes both digital signal and analog signal, which demands the designer to use the CAD Tool with highly pretty profession and attention. (CAD: Computer-Aided Design)
Apparently it refers to the processing cost. In general, the processing cost of odd number layers PCBs is virtually higher than the even number layers PCBs. Since the same inner layer processing cost but increasing the handling cost of outer layer.
Zener diode is also called stabilizing voltage diode; When it comes to its characteristics, that is maintaining the load voltage in a stable value and preventing it from the influence of supply voltage changing.
Zener diode - Wikipedia
The major limitation lies in the fabrication process of integrated circuitwhich refers to make an integrated circuit adapted to various application circuits;